SEMICONDUCTOR DEVICE INCLUDING AN ELECTRICAL CONTACT WITH A METAL LAYER ARRANGED THEREON

A semiconductor device includes a semiconductor die, an electrical contact arranged on a surface of the semiconductor die, and a metal layer arranged on the electrical contact, wherein the metal layer includes a singulated part of at least one of a metal foil, a metal sheet, a metal leadframe, or a...

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Bibliographic Details
Main Authors HELLMUND, Oliver, MURI, Ingo, EICHINGER, Barbara, MEYER, Thorsten
Format Patent
LanguageEnglish
Published 03.06.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a semiconductor die, an electrical contact arranged on a surface of the semiconductor die, and a metal layer arranged on the electrical contact, wherein the metal layer includes a singulated part of at least one of a metal foil, a metal sheet, a metal leadframe, or a metal plate. When viewed in a direction perpendicular to the surface of the semiconductor die, a footprint of the electrical contact and a footprint of the metal layer are substantially congruent.
Bibliography:Application Number: US202017101339