METHOD OF MAKING STACKED ACOUSTIC WAVE RESONATOR PACKAGE WITH LASER-DRILLED VIAS
A packaged acoustic wave component is disclosed. The packaged acoustic wave component can include a first acoustic wave resonator that includes a first interdigital transducer electrode that is positioned over a first piezoelectric layer. The packaged acoustic wave component can also include a secon...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
20.05.2021
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A packaged acoustic wave component is disclosed. The packaged acoustic wave component can include a first acoustic wave resonator that includes a first interdigital transducer electrode that is positioned over a first piezoelectric layer. The packaged acoustic wave component can also include a second acoustic wave resonator including a second interdigital transducer electrode positioned over a second piezoelectric layer. The second piezoelectric layer is bonded to the first piezoelectric layer. The packaged acoustic wave component can further include a stopper structure that is positioned over the first piezoelectric layer. The first stopper structure is positioned above a via and extends through the first piezoelectric layer. The stopper structure is in electrical communication with the first interdigital transducer electrode and includes a material which reflects at least fifty percent of light having a wavelength of 355 nanometers. |
---|---|
Bibliography: | Application Number: US202017135567 |