METHOD OF TRANSFER PRINTING

A transfer printing method is described that can be used for a wide variety of materials, such as to allow for circuits formed of different materials to be integrated together on a single integrated circuit. A tether (18) is formed on dice regions (16) of a first wafer (30), followed by attachment o...

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Bibliographic Details
Main Authors Flanders, Kenneth, Kotlanka, Rama Krishna, Delaus, Michael D, Duffy, Matthew, lutzi, Ryan, Fiorenza, James G, Feindt, Susan L
Format Patent
LanguageEnglish
Published 06.05.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A transfer printing method is described that can be used for a wide variety of materials, such as to allow for circuits formed of different materials to be integrated together on a single integrated circuit. A tether (18) is formed on dice regions (16) of a first wafer (30), followed by attachment of a second wafer (32) to the tethers. The dice regions (16) are processed so as to be separated, followed by transfer printing of the dice regions to a third wafer (34).
Bibliography:Application Number: US201816486695