COLD PLATE SYSTEM INTERFACE FOR LIQUID COOLED DEVICES

• Main Authors: Cevallos Palomeque, Juan G, Sivapalan, Sean T, Valentine, Curtis A, Soeung, Rithi S, Williams, Carl D, Johnson, Jordan, Sprenger, Mark E, Amoah-Kusi, Christian, Hanna, Timothy Glen, Ding, Peipei, Sarangi, Suchismita
• Format: Patent
• Language: English
• Published: 29.04.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

An apparatus is described. The apparatus includes a cold plate. The ruler factor cold plate is to receive heat from semiconductor chips of a electronic component that is to be plugged into an electronic system. The cold plate has at least one of: a) a linearly advancing physical interface, the linearly advancing physical interface to make physical contact with a corresponding linearly advancing physical interface of a cooling component of the electronic system, the physical contact to create a thermal path from the cold plate to the cooling component; b) first fingers on a first face of the cold plate to make spring-force thermal contact with the semiconductor chips of the electronic component and second fingers on an opposite second face of the cold plate to make spring-force thermal contact with the respective semiconductor chips of another, neighboring electronic component.