INTER-LAYER SLOT FOR INCREASING PRINTED CIRCUIT BOARD POWER PERFORMANCE

A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically cou...

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Bibliographic Details
Main Authors WARNER, Michael James, CAPILLO, JR., Carmen A, YU, Mingyi, BODI, Gregory Patrick, ATTALURI, Ananta H
Format Patent
LanguageEnglish
Published 29.04.2021
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A printed circuit board includes a first voltage plane disposed on a first surface of a first electrically insulating layer and a second voltage plane. An inter-layer slot that is formed through the first electrically insulating layer and includes an electrically conductive material electrically couples the first voltage plane to the second voltage plane.
Bibliography:Application Number: US202017081916