OHMIC ALLOY CONTACT REGION SEALING LAYER
Forming an ohmic contact sealing layer disposed at an intersection between a sidewall of an ohmic contact and a surface of a semiconductor; forming an ohmic contact sealing layer on the intersection between a sidewall of the ohmic contact and the surface of the semiconductor; and subjecting the semi...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
15.04.2021
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Subjects | |
Online Access | Get full text |
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Summary: | Forming an ohmic contact sealing layer disposed at an intersection between a sidewall of an ohmic contact and a surface of a semiconductor; forming an ohmic contact sealing layer on the intersection between a sidewall of the ohmic contact and the surface of the semiconductor; and subjecting the semiconductor with the ohmic contact to a chemical etchant. |
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Bibliography: | Application Number: US201916599650 |