FINGER PAD LEADFRAME

A packaged semiconductor device includes a leadframe including a finger pad(s) that is integrated, and spans a finger pad area including a width narrower than its length. A first portion of the finger pad area provides a die support area. A second portion of the finger pad area provides a wire bond...

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Bibliographic Details
Main Authors Chien, Yuh-Harng, Chien, Jason, Ho, J K
Format Patent
LanguageEnglish
Published 15.04.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A packaged semiconductor device includes a leadframe including a finger pad(s) that is integrated, and spans a finger pad area including a width narrower than its length. A first portion of the finger pad area provides a die support area. A second portion of the finger pad area provides a wire bond area including first and second wire bond pads on a first and second side of the die support area. One of the wire bond pads further includes a lead terminal integrally connected. The IC die has a top side with bond pads and a back side having a non-electrically conductive die attach material attached to the die support area. Bond wires extend from the bond pads to the first and second wire bond pads. A mold compound encapsulates the packaged semiconductor device leaving exposed at least the lead terminal on a bottom side of the packaged semiconductor device.
Bibliography:Application Number: US201916600615