DATA CENTER COOLING SYSTEM

This disclosure describes systems for cooling one or more data halls of a data center that include one or more sections of a cooling spine. Each section of the cooling spine includes a riser module, a manifold module, and one or more arrays of cooling units. The riser module includes riser piping co...

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Bibliographic Details
Main Author McCarthy, Chad
Format Patent
LanguageEnglish
Published 08.04.2021
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:This disclosure describes systems for cooling one or more data halls of a data center that include one or more sections of a cooling spine. Each section of the cooling spine includes a riser module, a manifold module, and one or more arrays of cooling units. The riser module includes riser piping configured to fluidically couple to a liquid cooling system. The manifold module includes manifold piping fluidically coupled to the riser piping. Each array of cooling units is positioned toward a data hall of the one or more data halls of the data center and includes a heat exchanger assembly and a circulation assembly. The heat exchanger assembly is fluidically coupled to the manifold piping and configured to cool return air from a hot aisle adjacent a row of cabinets. The circulation assembly is configured to discharge supply air to a cold aisle adjacent the row of cabinets.
Bibliography:Application Number: US202016911231