INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED INTERCONNECT LINES IN A SAME DIELECTRIC LAYER

• Main Authors: SELL, Bernhard, SHARMA, Abhishek A, WANG, Pei-Hua, KAVALIEROS, Jack T, LAJOIE, Travis W, ALZATE VINASCO, Juan G, GARDINER, Allen B, LIN, Blake C, KU, Chieh-Jen, OGADHOH, Shem O, WANG, Yih, GHANI, Tahir
• Format: Patent
• Language: English
• Published: 01.04.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Integrated circuit structures having differentiated interconnect lines in a same dielectric layer, and methods of fabricating integrated circuit structures having differentiated interconnect lines in a same dielectric layer, are described. In an example, an integrated circuit structure includes an inter-layer dielectric (ILD) layer above a substrate. A plurality of conductive interconnect lines is in the ILD layer. The plurality of conductive interconnect lines includes a first interconnect line having a first height, and a second interconnect line immediately laterally adjacent to but spaced apart from the first interconnect line, the second interconnect line having a second height less than the first height.