METHOD FOR MICROWELDING FLEXIBLE THIN FILMS, FOR EXAMPLE FOR USE IN ELECTRICAL AND ELECTRONIC DEVICES
The invention relates to a method for welding a flexible film (10) to a carrier component (20), having the following steps: 1) pressing the film (10) on the carrier component (20) by a volumetric flowof a fluid, and 2) laser welding the film (10) on the carrier component (20).
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
01.04.2021
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Subjects | |
Online Access | Get full text |
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Abstract | The invention relates to a method for welding a flexible film (10) to a carrier component (20), having the following steps: 1) pressing the film (10) on the carrier component (20) by a volumetric flowof a fluid, and 2) laser welding the film (10) on the carrier component (20). |
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AbstractList | The invention relates to a method for welding a flexible film (10) to a carrier component (20), having the following steps: 1) pressing the film (10) on the carrier component (20) by a volumetric flowof a fluid, and 2) laser welding the film (10) on the carrier component (20). |
Author | Heider, Andreas Bormann, Axel Proell, Johannes Kunz, Gerhard Alter, Lukas |
Author_xml | – fullname: Proell, Johannes – fullname: Kunz, Gerhard – fullname: Alter, Lukas – fullname: Heider, Andreas – fullname: Bormann, Axel |
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RelatedCompanies | Robert Bosch GmbH |
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Snippet | The invention relates to a method for welding a flexible film (10) to a carrier component (20), having the following steps: 1) pressing the film (10) on the... |
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SubjectTerms | CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
Title | METHOD FOR MICROWELDING FLEXIBLE THIN FILMS, FOR EXAMPLE FOR USE IN ELECTRICAL AND ELECTRONIC DEVICES |
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