METHOD FOR MICROWELDING FLEXIBLE THIN FILMS, FOR EXAMPLE FOR USE IN ELECTRICAL AND ELECTRONIC DEVICES

The invention relates to a method for welding a flexible film (10) to a carrier component (20), having the following steps: 1) pressing the film (10) on the carrier component (20) by a volumetric flowof a fluid, and 2) laser welding the film (10) on the carrier component (20).

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Bibliographic Details
Main Authors Proell, Johannes, Kunz, Gerhard, Alter, Lukas, Heider, Andreas, Bormann, Axel
Format Patent
LanguageEnglish
Published 01.04.2021
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:The invention relates to a method for welding a flexible film (10) to a carrier component (20), having the following steps: 1) pressing the film (10) on the carrier component (20) by a volumetric flowof a fluid, and 2) laser welding the film (10) on the carrier component (20).
Bibliography:Application Number: US202017036031