HIGH MOLECULAR WEIGHT POLYVINYL PYRROLIDONE FOR LOW-K REMOVAL RATE SUPPRESION

Provided herein are compositions and methods for polishing surfaces comprising one or more low-k materials and optionally one or more additional materials (e.g., Cu, Ta, Co, Ni, etc.), e.g., in semiconductor device fabrication. Embodiments include a composition for chemical mechanical polishing of a...

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Bibliographic Details
Main Author GRANSTROM, Jimmy Erik
Format Patent
LanguageEnglish
Published 18.03.2021
Subjects
ADHESIVES
CHEMISTRY
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SKI WAXES
TRANSPORTING
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Summary:Provided herein are compositions and methods for polishing surfaces comprising one or more low-k materials and optionally one or more additional materials (e.g., Cu, Ta, Co, Ni, etc.), e.g., in semiconductor device fabrication. Embodiments include a composition for chemical mechanical polishing of a surface comprising a low-k material (e.g., Black Diamond (BD)) the composition comprising an abrasive, a solvent, and a polymeric low-k suppressor.
Bibliography:Application Number: US202016987632