HIGH CONDUCTANCE LOWER SHIELD FOR PROCESS CHAMBER

Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes an annular ring configured to surround a substrate support; and an annular lip extending from an upper surface of the annular ring, wherein the annul...

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Bibliographic Details
Main Authors Wada, Yuichi, Boh, Kelvin, Babu, Sarath, Jupudi, Ananthkrishna, Wei, Junqi, Zhang, Kang, Ow, Yueh Sheng
Format Patent
LanguageEnglish
Published 04.03.2021
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Summary:Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes an annular ring configured to surround a substrate support; and an annular lip extending from an upper surface of the annular ring, wherein the annular ring includes a plurality of ring slots extending through the annular ring and disposed at regular intervals along the annular ring, and wherein the annular lip includes a plurality of lip slots extending through the annular lip disposed at regular intervals along the annular lip.
Bibliography:Application Number: US201916664155