HIGH CONDUCTANCE LOWER SHIELD FOR PROCESS CHAMBER
Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes an annular ring configured to surround a substrate support; and an annular lip extending from an upper surface of the annular ring, wherein the annul...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
04.03.2021
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Subjects | |
Online Access | Get full text |
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Summary: | Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes an annular ring configured to surround a substrate support; and an annular lip extending from an upper surface of the annular ring, wherein the annular ring includes a plurality of ring slots extending through the annular ring and disposed at regular intervals along the annular ring, and wherein the annular lip includes a plurality of lip slots extending through the annular lip disposed at regular intervals along the annular lip. |
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Bibliography: | Application Number: US201916664155 |