CONNECTION FEATURES FOR ELECTRONIC AND OPTICAL PACKAGING

An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechani...

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Bibliographic Details
Main Authors PETERNEL, Joyce J. M, RAZDAN, Sandeep, MAKER, Ashley J, TRAVERSO, Matthew J, PRASAD, Aparna R
Format Patent
LanguageEnglish
Published 25.02.2021
Subjects
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Summary:An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.
Bibliography:Application Number: US201916544699