SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME AND BIOMETRIC IDENTIFICATION APPARATUS USING THE SAME

A semiconductor device includes a conductive substrate and an encapsulation structure. The conductive substrate has a plurality of pixels. The encapsulation structure is disposed on the conductive substrate and includes at least one light-collimating unit. The light-collimating unit includes a trans...

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Bibliographic Details
Main Authors Liao, Chih-Cherng, Chung, Wei-Lun, Liu, Shih-Hao, Lu, Wu-Hsi, Lao, Chung-Ren, Lo, Ming-Cheng
Format Patent
LanguageEnglish
Published 18.02.2021
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a conductive substrate and an encapsulation structure. The conductive substrate has a plurality of pixels. The encapsulation structure is disposed on the conductive substrate and includes at least one light-collimating unit. The light-collimating unit includes a transparent substrate and a patterned light-shielding layer. The patterned light-shielding layer is disposed on the transparent substrate. The patterned light-shielding layer has a plurality of holes disposed to correspond to the pixels.
Bibliography:Application Number: US201916541889