CLIPS FOR SEMICONDUCTOR PACKAGES
A clip for a semiconductor package includes a first portion and a second portion. The first portion includes a first surface, a second surface opposite to the first surface and configured to contact a first electrically conductive component, and a stepped region between the first surface and the sec...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
11.02.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A clip for a semiconductor package includes a first portion and a second portion. The first portion includes a first surface, a second surface opposite to the first surface and configured to contact a first electrically conductive component, and a stepped region between the first surface and the second surface such that the second surface has a smaller area than the first surface. The second portion is coupled to the first portion and configured to contact a second electrically conductive component. The second portion includes a third surface aligned with the first surface. |
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Bibliography: | Application Number: US201916535632 |