CLIPS FOR SEMICONDUCTOR PACKAGES

A clip for a semiconductor package includes a first portion and a second portion. The first portion includes a first surface, a second surface opposite to the first surface and configured to contact a first electrically conductive component, and a stepped region between the first surface and the sec...

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Bibliographic Details
Main Authors Wong, Jia Yi, Tean, Ke Yan, Hiew, Mei Fen
Format Patent
LanguageEnglish
Published 11.02.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A clip for a semiconductor package includes a first portion and a second portion. The first portion includes a first surface, a second surface opposite to the first surface and configured to contact a first electrically conductive component, and a stepped region between the first surface and the second surface such that the second surface has a smaller area than the first surface. The second portion is coupled to the first portion and configured to contact a second electrically conductive component. The second portion includes a third surface aligned with the first surface.
Bibliography:Application Number: US201916535632