ELECTRICAL CONNECTION STRUCTURE AND METHOD FOR MAKING SAME, TFT SUBSTRATE AND METHOD FOR MAKING SAME

An electrical connection structure includes a substrate, a mating layer on the substrate, a connecting pad on the mating layer, an insulating layer on the mating layer and covering the connecting pad, a connecting line on the insulating layer, and a covering layer on the insulating layer and coverin...

Full description

Saved in:
Bibliographic Details
Main Authors LIU, CHIA-LIN, LIAO, CHIN-YUEH, DAI, YAN-TANG, LU, HUNG
Format Patent
LanguageEnglish
Published 11.02.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:An electrical connection structure includes a substrate, a mating layer on the substrate, a connecting pad on the mating layer, an insulating layer on the mating layer and covering the connecting pad, a connecting line on the insulating layer, and a covering layer on the insulating layer and covering the connecting line. The connecting line extends through the insulating layer to electrically couple to the connecting pad. Both the connecting pad and the connecting line are made of metal or alloy. The mating layer includes yttrium oxide films and silicon oxide films alternating with each other.
Bibliography:Application Number: US202017079160