ASSEMBLY MOULD TO MANUFACTURE A THREE-DIMENSIONAL DEVICE COMPRISING SEVERAL MICROELECTRONIC COMPONENTS

• Main Authors: BRUN, Jean, POULET, Sylvain, BEDJAOUI, Messaoud
• Format: Patent
• Language: English
• Published: 28.01.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRICITY; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY

To provide a method for easily and accurately stacking microelectronic components and easily performing electric interconnection of these components.SOLUTION: There is provided a reusable assembly mold (500) for manufacturing a three-dimensional device comprising several vertically stacked microelectronic components, the assembly mold comprising a main cavity formed by a bottom and a side wall, the main cavity being configured to receive at least two stacked structures. Each elementary structure comprises a brittle substrate (200) covered with a microelectronic component and with electrical contacts (210) disposed on the edge of the substrate (200). The assembly mold (500) is made of a deformable material. The assembly mold (500) further comprises a clearance (510) positioned along the side wall of the main cavity to facilitate handling of a first elementary structure and/or a second elementary structure and/or to inject an element along the main cavity.SELECTED DRAWING: Figure 7a