CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BUMP HEIGHT RANGE

• Main Authors: HAEHN, Nicholas S, HEATON, Thomas, CETEGEN, Edvin, CHAN ARGUEDAS, Sergio, JAIN, Rahul, CHO, Steve S, SINGH, Antariksh Rao Pratap, VEHONSKY, Jacob, IBRAHIM, Tarek, NEAL, Nicholas
• Format: Patent
• Language: English
• Published: 21.01.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment an electronic package comprises a package substrate, and a first level interconnect (FLI) bump region on the package substrate. In an embodiment, the FLI bump region comprises a plurality of pads, and a plurality of bumps, where each bump is over a different one of the plurality of pads. In an embodiment, the electronic package further comprises a guard feature adjacent to the FLI bump region. In an embodiment, the guard feature comprises, a guard pad, and a guard bump over the guard pad, wherein the guard feature is electrically isolated from circuitry of the electronic package.