CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BUMP HEIGHT RANGE

Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment an electronic package comprises a package substrate, and a first level interconnect (FLI) bump region on the package substrate. In an embodiment, the FLI bump region comprises a plurality...

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Bibliographic Details
Main Authors HAEHN, Nicholas S, HEATON, Thomas, CETEGEN, Edvin, CHAN ARGUEDAS, Sergio, JAIN, Rahul, CHO, Steve S, SINGH, Antariksh Rao Pratap, VEHONSKY, Jacob, IBRAHIM, Tarek, NEAL, Nicholas
Format Patent
LanguageEnglish
Published 21.01.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment an electronic package comprises a package substrate, and a first level interconnect (FLI) bump region on the package substrate. In an embodiment, the FLI bump region comprises a plurality of pads, and a plurality of bumps, where each bump is over a different one of the plurality of pads. In an embodiment, the electronic package further comprises a guard feature adjacent to the FLI bump region. In an embodiment, the guard feature comprises, a guard pad, and a guard bump over the guard pad, wherein the guard feature is electrically isolated from circuitry of the electronic package.
Bibliography:Application Number: US201916511376