PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

Embodiments disclosed herein include electronic packages with underfill flow control features. In an embodiment, an electronic package comprises a package substrate and a plurality of interconnects on the package substrate. In an embodiment, a die is coupled to the package substrate by the plurality...

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Bibliographic Details
Main Authors HAEHN, Nicholas S, HEATON, Thomas, CETEGEN, Edvin, CHAN ARGUEDAS, Sergio, JAIN, Rahul, MEHTA, Vipul, CHO, Steve S, SINGH, Antariksh Rao Pratap, VEHONSKY, Jacob, IBRAHIM, Tarek, NEAL, Nicholas
Format Patent
LanguageEnglish
Published 21.01.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments disclosed herein include electronic packages with underfill flow control features. In an embodiment, an electronic package comprises a package substrate and a plurality of interconnects on the package substrate. In an embodiment, a die is coupled to the package substrate by the plurality of interconnects and a flow control feature is adjacent on the package substrate. In an embodiment, the flow control feature is electrically isolated from circuitry of the electronic package. In an embodiment, the electronic package further comprises an underfill surrounding the plurality of interconnects and in contact with the flow control feature.
Bibliography:Application Number: US201916511360