Method of inspecting a semiconductor processing chamber using a vision sensor, and method for manufaturing a semiconductor device using the same
A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | English |
Published |
14.01.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module. |
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Bibliography: | Application Number: US202016791564 |