PICK AND PLACE MACHINE CLEANING SYSTEM AND METHOD

A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include...

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Bibliographic Details
Main Authors Smith, Wayne C, Humphrey, Alan E, Humphrey, Bret A, Broz, Jerry J
Format Patent
LanguageEnglish
Published 07.01.2021
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
CONVEYING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING THIN OR FILAMENTARY MATERIAL
PACKING
PERFORMING OPERATIONS
PNEUMATIC TUBE CONVEYORS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
SHOP CONVEYOR SYSTEMS
STORING
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING
TRANSPORTING
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Summary:A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
Bibliography:Application Number: US201916460929