RFI FREE PICTURE FRAME METAL STIFFENER

Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a package substrate on a substrate, a die on the package substrate, and a conductive stiffener over the package substrate and the substrate. The conductive stiffener surround...

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Bibliographic Details
Main Authors YONG, Khang Choong, KOH, Boon Ping, LIM, Min Suet, SONG, Wil Choon, GOH, Eng Huat, SIR, Jiun Hann
Format Patent
LanguageEnglish
Published 31.12.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a package substrate on a substrate, a die on the package substrate, and a conductive stiffener over the package substrate and the substrate. The conductive stiffener surrounds the package substrate, where the conductive stiffener has a top portion and a plurality of sidewalls, and where the top portion is directly disposed on the package substrate, and the sidewalls are vertically disposed on the substrate. The semiconductor package also includes the substrate that has a plurality of conductive pads, where the conductive pads are conductively coupled to a ground source. The conductive stiffener may conductively couple the package substrate to the conductive pads of the substrate. The top portion may have a cavity that surrounds the die, where the top portion is directly disposed on a plurality of outer edges of the package substrate.
Bibliography:Application Number: US201916454423