Fabricating Sub-Lithographic Devices

A sub-lithographic device, and a method of fabricating the device, is provided. The method includes determining a lithographic size constraint, and determining size and position of sub-lithographic components of the device. A resist layer is deposited on a substrate, and a mask is positioned over th...

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Bibliographic Details
Main Authors Sharma, Gian, Levi, Amitay
Format Patent
LanguageEnglish
Published 31.12.2020
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:A sub-lithographic device, and a method of fabricating the device, is provided. The method includes determining a lithographic size constraint, and determining size and position of sub-lithographic components of the device. A resist layer is deposited on a substrate, and a mask is positioned over the substrate. The mask includes an aperture corresponding to a first region of the resist layer. After positioning the mask, the resist layer is partially exposed to a radiant energy. The mask is adjusted such that the aperture corresponds to a second region of the resist layer. The overlap of the first region and the second region corresponds to the position of a component of the device. The resist layer is partially exposed again to the radiant energy. An opening is formed in the resist layer by removing fully exposed portion of the resist layer. Subsequently, material for the component is deposited within the opening.
Bibliography:Application Number: US201916452302