VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES

Disclosed herein are vented lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A vent may extend between the interior surface a...

Full description

Saved in:
Bibliographic Details
Main Authors Wan, Zhimin, Li, Peng, Antoniswamy, Aravindha R, Chan Arguedas, Sergio Antonio, Zhao, Junnan, Jha, Chandra Mohan, Xu, Cheng, Wang, Ying
Format Patent
LanguageEnglish
Published 24.12.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Disclosed herein are vented lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A vent may extend between the interior surface and the exterior surface of the lid, and the vent may at least partially overlap the die.
Bibliography:Application Number: US201916446538