SEMICONDUCTOR PACKAGE

A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and...

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Bibliographic Details
Main Authors PARK, Seong Chan, KANG, Seung On, KIM, Hyung Kyu, KWON, Sang Hyun, KIM, Han
Format Patent
LanguageEnglish
Published 17.12.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and including a graphite-based material, an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member, disposed on the active surface of the semiconductor chip, including a redistribution layer electrically connected to the connection pad. 0<b<0.6a, in which "a" denotes a planar area of the heat dissipation member and "b" denotes a sum of planar areas of the plurality of holes on a plane.
Bibliography:Application Number: US201916567560