ABSORPTION ENHANCEMENT STRUCTURE FOR IMAGE SENSOR

The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. The substrate has a plurality of protrusions disposed along a first side of the substrate over the image sensing element and a ridge disposed along the first side...

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Bibliographic Details
Main Authors Su, Ching-Chung, Hsu, Hung-Wen, Chou, Shih-Pei, Lu, Jiech-Fun
Format Patent
LanguageEnglish
Published 10.12.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present disclosure relates to an integrated chip. The integrated chip includes an image sensing element disposed within a substrate. The substrate has a plurality of protrusions disposed along a first side of the substrate over the image sensing element and a ridge disposed along the first side of the substrate. The ridge continuously extends around the plurality of protrusions.
Bibliography:Application Number: US202017002042