IMAGING DEVICE AND SIGNAL PROCESSING DEVICE

• Main Authors: NAKAZAWA, Keiichi, TAKEYA, Yukari, SAKANO, Yorito, OGI, Jun, ZHU, Hongbo, HORIUCHI, Atsushi, TOYOSHIMA, Takahiro, TASHIRO, Yoshiaki, MATSUMOTO, Ryosuke, OIKE, Yusuke, OKUYAMA, Atsushi, MIYOSHI, Yasufumi
• Format: Patent
• Language: English
• Published: 19.11.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

To realize miniaturization of a pixel, reduction in noise, and high quantum efficiency, and to improve short-wavelength sensitivity while suppressing inter-pixel interference and variations for each pixel. According to the present disclosure, there is provided an imaging device including: a first semiconductor layer formed in a semiconductor substrate; a second semiconductor layer of a conductivity type opposite to a conductivity type of the first semiconductor layer formed on the first semiconductor layer; a pixel separation unit which defines a pixel region including the first semiconductor layer and the second semiconductor layer; a first electrode which is connected to the first semiconductor layer from one surface side of the semiconductor substrate; and a second electrode which is connected to the second semiconductor layer from a light irradiation surface side that is the other surface of the semiconductor substrate, and is formed to correspond to a position of the pixel separation unit.