SEMICONDUCTOR DEVICE

A semiconductor device has a coil and wirings under the coil. In addition, a distance between the upper face of the wirings and the bottom face of the coil is 7 μm or larger, and the wirings have a plurality of linear wiring parts each wiring width of which is 1 μm or smaller. In addition, the linea...

Full description

Saved in:
Bibliographic Details
Main Authors IIDA, Tetsuya, NAKASHIBA, Yasutaka, ONO, Akio, KUWAJIMA, Teruhiro, MATSUMOTO, Akira
Format Patent
LanguageEnglish
Published 19.11.2020
Subjects
AUTOMATIC CONTROL, STARTING, SYNCHRONISATION, OR STABILISATIONOF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A semiconductor device has a coil and wirings under the coil. In addition, a distance between the upper face of the wirings and the bottom face of the coil is 7 μm or larger, and the wirings have a plurality of linear wiring parts each wiring width of which is 1 μm or smaller. In addition, the linear wiring parts do not configure a loop wiring, and the coil and the linear wiring parts are overlapped with each other in planar view.
Bibliography:Application Number: US202016984710