METAL OR METAL ALLOY DEPOSITION COMPOSITION AND PLATING COMPOUND

• Main Authors: FROESE, Bernd, BANGERTER, Timo, MANN, Olivier, HAUBNER, Kinga, LLAVONA-SERRANO, Angela, CEBULLA, Pamela, ACKERMANN, Stefanie, BRUNNER, Heiko
• Format: Patent
• Language: English
• Published: 29.10.2020
• Subjects: APPARATUS THEREFOR; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.