SEMICONDUCTOR MEMORY DEVICE

A semiconductor memory device according to an embodiment includes a memory chip and a circuit chip. The memory chip includes first and second joint metals. The circuit chip includes first and second sense amplifiers, and third and fourth joint metals facing the first and second joint metals, respect...

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Bibliographic Details
Main Authors MOROZUMI, Naohito, MAEJIMA, Hiroshi
Format Patent
LanguageEnglish
Published 22.10.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
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Summary:A semiconductor memory device according to an embodiment includes a memory chip and a circuit chip. The memory chip includes first and second joint metals. The circuit chip includes first and second sense amplifiers, and third and fourth joint metals facing the first and second joint metals, respectively. The first sense amplifier includes first and second active regions. The first active region includes a first transistor coupled between the third joint metal and the second active region. The second amplifier includes third and fourth active region. The third active region includes a second transistor coupled between the fourth joint metal and the fourth active region. The third and fourth joint metals overlap the first and third active regions, respectively.
Bibliography:Application Number: US202016795763