METHOD FOR MANUFACTURING INDUCTOR BUILT-IN SUBSTRATE

A method for manufacturing an inductor built-in substrate includes forming openings in a core substrate including a resin substrate and a metal foil laminated on the resin substrate, filling a magnetic resin in the openings formed in the substrate, forming a shield layer including a first plating fi...

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Bibliographic Details
Main Authors Kodama, Hiroaki, Kuranobu, Kazuhiko, Uno, Hiroaki, Nishiwaki, Kazuro
Format Patent
LanguageEnglish
Published 22.10.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
SEMICONDUCTOR DEVICES
TRANSFORMERS
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Summary:A method for manufacturing an inductor built-in substrate includes forming openings in a core substrate including a resin substrate and a metal foil laminated on the resin substrate, filling a magnetic resin in the openings formed in the substrate, forming a shield layer including a first plating film on the substrate and on a surface of the magnetic resin such that the shielding layer is formed on the metal foil and on the surface of the magnetic resin, forming first through holes in the substrate, applying a desmear treatment in the first through holes, forming second through holes in the magnetic resin after the desmear treatment, and forming a second plating film on the substrate, on the magnetic resin, and in the first and second through holes such that the second plating film is formed on the shield layer, in the first through holes, and in the second through holes.
Bibliography:Application Number: US202016850470