METHOD OF MANUFACTURING A LEAD FRAME, METHOD OF MANUFACTURING AN ELECTRONIC APPARATUS, AND ELECTRONIC APPARATUS

[Object] Provided is a method of manufacturing a lead frame capable of forming connection terminals in a plurality of rows around a circuit chip without requiring a complex manufacturing process and many processes. [Solving Means] The method of manufacturing a lead frame includes attaching a tape me...

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Bibliographic Details
Main Authors OZAKI, HIROSHI, HOSOKAWA, KOYO
Format Patent
LanguageEnglish
Published 08.10.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:[Object] Provided is a method of manufacturing a lead frame capable of forming connection terminals in a plurality of rows around a circuit chip without requiring a complex manufacturing process and many processes. [Solving Means] The method of manufacturing a lead frame includes attaching a tape member to a lead frame member including at least a lead frame rim. A lead frame part including at least one of a die pad or a connection terminal is mounted on the tape member in the lead frame rim.
Bibliography:Application Number: US201716301203