COMPOSITIONS FOR POLISHING COBALT AND LOW-K MATERIAL SURFACES

Provided herein are compositions and methods for polishing surfaces comprising cobalt and optionally a low-K material, e.g., in semiconductor device fabrication. Also provided herein are compositions and methods for polishing surfaces comprising a metal and/or silicate material and a low-K material....

Full description

Saved in:
Bibliographic Details
Main Authors POUTASSE, Charles, KIM, Hooi-Sung
Format Patent
LanguageEnglish
Published 01.10.2020
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
Online AccessGet full text

Cover

More Information
Summary:Provided herein are compositions and methods for polishing surfaces comprising cobalt and optionally a low-K material, e.g., in semiconductor device fabrication. Also provided herein are compositions and methods for polishing surfaces comprising a metal and/or silicate material and a low-K material. Embodiments include a slurry for chemical mechanical polishing a surface comprising cobalt and low-K materials, such as Black Diamond (BD) or SiN, comprising a complexor, an oxidizer, an abrasive, a Co corrosion inhibitor and an ILD suppressor. Embodiments also include a slurry for chemical mechanical polishing a surface comprising a metal and/or silicate material such as cobalt, copper, tantalum, and/or TEOS and a low-K material, such as Black Diamond (BD) or SiN, comprising a complexor, an oxidizer, an abrasive, a corrosion inhibitor, and a non-ionic surfactant.
Bibliography:Application Number: US201916539600