SEMICONDUCTOR PACKAGE WITH HEATSINK

According to an aspect, a semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface, a semiconductor die coupled to the second surface of the substrate, and a molding encapsulating the semiconductor die and a majority of the substrate, where...

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Bibliographic Details
Main Authors CABAHUG, Elsie Agdon, TEYSSEYRE, Jerome, QUINONES, Maria Clemens Ypil
Format Patent
LanguageEnglish
Published 27.08.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:According to an aspect, a semiconductor package includes a substrate having a first surface and a second surface opposite to the first surface, a semiconductor die coupled to the second surface of the substrate, and a molding encapsulating the semiconductor die and a majority of the substrate, where at least a portion of the first surface is exposed through the molding such that the substrate is configured to function as a heat sink.
Bibliography:Application Number: US201916506405