CRYSTALLINE CARBON HEAT SPREADING MATERIALS FOR IC DIE HOT SPOT REDUCTION

IC packages including a heat spreading material comprising crystalline carbon. The heat spreading material may be applied directly to an IC die surface, for example at a die prep stage, prior to an application or build-up of packaging material, so that the high thermal conductivity may best mitigate...

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Bibliographic Details
Main Authors Karhade, Omkar, Modi, Mitul, Bai, Yiqun, Cetegen, Edvin, Uppal, Aastha, Ganesan, Sanka, Mallik, Debendra, Singh, Kumar, Deshpande, Nitin, Krajniak, Jan
Format Patent
LanguageEnglish
Published 27.08.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:IC packages including a heat spreading material comprising crystalline carbon. The heat spreading material may be applied directly to an IC die surface, for example at a die prep stage, prior to an application or build-up of packaging material, so that the high thermal conductivity may best mitigate any hot spots that develop at the IC die surface during operation. The heat spreading material may be applied to surface of the IC die.
Bibliography:Application Number: US201916287668