RESIN CARD MEDIUM AND MANUFACTURING METHOD THEREFOR
A resin card medium laminated body before pressing is prepared by laminating, on a first plastic finishing sheet, a substrate having one electronic component or two or more electronic components installed on one side of the substrate, with the one side, on which the electronic component or electroni...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
20.08.2020
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A resin card medium laminated body before pressing is prepared by laminating, on a first plastic finishing sheet, a substrate having one electronic component or two or more electronic components installed on one side of the substrate, with the one side, on which the electronic component or electronic components are installed, facing upward, and laminating, on the substrate, mixed paper constituted of plastic fibers and plant fibers, and by subjecting the resin card medium laminated body to hot pressing at a temperature which is a softening point or more of the plastic fibers and less than a melting point of the plastic fibers. |
---|---|
Bibliography: | Application Number: US201816649303 |