Integrated Assemblies Having Capacitive Units, and Having Resistive Structures Coupled with the Capacitive Units

Some embodiments include an integrated assembly having a capacitive unit which includes a plurality of capacitive subunits. A first conductive structure is under a first group of the capacitive subunits and is coupled with them. A second conductive structure is under a second group of the capacitive...

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Bibliographic Details
Main Authors Sugimoto, Satoru, Hosaka, Hiroki, Oishi, Hayato
Format Patent
LanguageEnglish
Published 30.07.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Some embodiments include an integrated assembly having a capacitive unit which includes a plurality of capacitive subunits. A first conductive structure is under a first group of the capacitive subunits and is coupled with them. A second conductive structure is under a second group of the capacitive subunits and is coupled with them. A third conductive structure is over the capacitive subunits and is coupled with all of the capacitive subunits. A resistive structure extends under the first and second conductive structures. The resistive structure has a first-end-region under the first conductive structure and coupled with the first conductive structure. The resistive structure includes resistive lines extending from the first-end-region to second-end-regions.
Bibliography:Application Number: US201916262087