METAL PASTE AND THERMOELECTRIC MODULE

The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which ad...

Full description

Saved in:
Bibliographic Details
Main Authors Park, Cheol-Hee, Kim, Dong-Sik, Lee, Dae Ki
Format Patent
LanguageEnglish
Published 02.07.2020
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste.
Bibliography:Application Number: US202016811359