INTER-DIE PASSIVE INTERCONNECTS APPROACHING MONOLITHIC PERFORMANCE

Inter-die passive interconnects are lengthened while locating I/O circuitry away from die edge, such that passive interconnect length is agglomerated toward the die edge, and inter-die communication is expedited.

Saved in:
Bibliographic Details
Main Authors Elsherbini, Adel A, Wu, Zuoguo, Pasdast, Gerald, Das Sharma, Debendra
Format Patent
LanguageEnglish
Published 02.07.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Inter-die passive interconnects are lengthened while locating I/O circuitry away from die edge, such that passive interconnect length is agglomerated toward the die edge, and inter-die communication is expedited.
Bibliography:Application Number: US201816236136