SEMICONDUCTOR PACKAGE

A semiconductor package includes a frame having first and second surfaces opposite to each other, having first and second through holes, and including a wiring structure connecting the first and second surfaces, a connection structure disposed on the first surface of the frame and having a redistrib...

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Bibliographic Details
Main Authors Ha, Job, Jeung, Jina, Kim, Sunghyun
Format Patent
LanguageEnglish
Published 25.06.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package includes a frame having first and second surfaces opposite to each other, having first and second through holes, and including a wiring structure connecting the first and second surfaces, a connection structure disposed on the first surface of the frame and having a redistribution layer connected to the wiring structure, a first semiconductor chip having a first surface having a first pad connected to the redistribution layer and a second surface opposite to the first surface and having a second pad, a second semiconductor chip having an active surface having a connection pad connected to the redistribution layer and an inactive surface opposite to the active surface, an encapsulant encapsulating the first and second semiconductor chips, and a wiring layer connected to the second pad of the first semiconductor chip and the wiring structure.
Bibliography:Application Number: US201916698275