SUBSTRATE PROCESSING APPARATUS
A substrate processing apparatus includes: a spin chuck, on which a substrate is mounted, the spin chuck rotating the substrate; At least one of a chemical liquid nozzle configured to provide a chemical liquid to a surface of the substrate and a deionzed water nozzle configured to provide a deionize...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
18.06.2020
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Subjects | |
Online Access | Get full text |
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Summary: | A substrate processing apparatus includes: a spin chuck, on which a substrate is mounted, the spin chuck rotating the substrate; At least one of a chemical liquid nozzle configured to provide a chemical liquid to a surface of the substrate and a deionzed water nozzle configured to provide a deionized water to a surface of the substrate; and a laser device configured to emit a pulse waver laser beam having a period of 10−9 seconds or less for etching an edge of the substrate. |
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Bibliography: | Application Number: US201916440201 |