METHOD OF MEASURING A PARAMETER OF A PATTERNING PROCESS, METROLOGY APPARATUS, TARGET

A technique of measuring a parameter of a patterning process is disclosed. In one arrangement, a target, formed by the patterning process, is illuminated. A sub-order diffraction component of radiation scattered from the target is detected and used to determine the parameter of the patterning proces...

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Bibliographic Details
Main Authors SCHREEL, Koenraad Remi Andre Maria, CHENG, Su-Ting, EURLINGS, Markus Franciscus Antonius, KOOLEN, Armand Eugene Albert, TARABRIN, Sergey, SOKOLOV, Sergei
Format Patent
LanguageEnglish
Published 18.06.2020
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:A technique of measuring a parameter of a patterning process is disclosed. In one arrangement, a target, formed by the patterning process, is illuminated. A sub-order diffraction component of radiation scattered from the target is detected and used to determine the parameter of the patterning process.
Bibliography:Application Number: US201916708509