THERMAL GROUND PLANE

• Main Authors: Oshman, Christopher, Bright, Victor M, Li, Chen, Peterson, George P, Cheng, Jen-Hau, Lee, Yung-Cheng, Shi, Bo, Yang, Ronggui
• Format: Patent
• Language: English
• Published: 18.06.2020
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; COMBINED OPERATIONS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MACHINE TOOLS; MECHANICAL ENGINEERING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OTHER WORKING OF METAL; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING; UNIVERSAL MACHINE TOOLS; WEAPONS

Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.