PLANARIZING BUILD SURFACES IN THREE-DIMENSIONAL PRINTING
A technique for planarizing build surfaces in three-dimensional printing includes the use of a three-dimensional printer having an extruder with a sensor mechanically coupled thereto, where the sensor is operable to sense a contact force between the extruder and a separate structure. In particular,...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
04.06.2020
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Subjects | |
Online Access | Get full text |
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Summary: | A technique for planarizing build surfaces in three-dimensional printing includes the use of a three-dimensional printer having an extruder with a sensor mechanically coupled thereto, where the sensor is operable to sense a contact force between the extruder and a separate structure. In particular, the sensor may be used to measure the contact force at a plurality of locations across a build surface of the separate structure, so that a difference between the measured contact force at two or more locations can be identified. In response to the difference between the measured contact force at these locations, a control signal may be created to reduce the difference for planarizing the build surface, e.g., by fabricating a layer on the build surface that mitigates irregularities therein, by gap filling on the build surface, or by adjusting a parameter of the three-dimensional printer. |
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Bibliography: | Application Number: US202016784889 |