SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP AND METHOD OF DICING A SEMICONDUCTOR SUBSTRATE

A semiconductor device includes a semiconductor substrate having a scribe lane defined therein. A plurality of semiconductor chips is formed on an upper surface of the semiconductor substrate. At least one conductive structure is arranged on an upper surface of the semiconductor substrate, within th...

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Main Authors KIM, YOON-SUNG, SIM, HYUN-SU, BAE, BYUNG-MOON, KIM, YUN-HEE, YOON, JUN-HO
Format Patent
LanguageEnglish
Published 28.05.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a semiconductor substrate having a scribe lane defined therein. A plurality of semiconductor chips is formed on an upper surface of the semiconductor substrate. At least one conductive structure is arranged on an upper surface of the semiconductor substrate, within the scribe lane thereof. A fillet is arranged on at least one side surface of the conductive structure. The fillet is configured to induce a cut line which spreads along the scribe lane, through a central portion of the conductive structure.
Bibliography:Application Number: US201916440692