WIRELESS POWER TRANSFER THIN PROFILE COIL ASSEMBLY

A thin resonant induction wireless power transmission transfer coil assembly designed for low loss and ease of manufacturing includes one or more printed circuit boards having a first conductor pattern wound in a spiral on a first side and a second conductor pattern wound in a spiral on a second sid...

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Bibliographic Details
Main Authors Keener, Moses M, McMahon, Francis J, Long, Bruce Richard, Daga, Andrew W, Wolgemuth, John M, Cohen, Benjamin H, Schrafel, Peter C
Format Patent
LanguageEnglish
Published 28.05.2020
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Summary:A thin resonant induction wireless power transmission transfer coil assembly designed for low loss and ease of manufacturing includes one or more printed circuit boards having a first conductor pattern wound in a spiral on a first side and a second conductor pattern wound in a spiral on a second side thereof, where the second conductor pattern is aligned with the first conductor pattern whereby the second conductor pattern reinforces magnetic flux generated by the first conductor pattern. The first and second conductor patterns are placed relative to one another so as to provide flux transmission in a same direction. One or more of such printed circuit boards form a wireless power transmission coil assembly with a conductive winding layer, a ferrite flux diversion layer, contormal spacing layers, an eddy current shield layer and an assembly enclosure.
Bibliography:Application Number: US201816615290