PACKAGE MODULE

A package module includes a core structure including a dummy member, one or more electronic components disposed around the dummy member, and an insulating material covering at least a portion of each of the dummy member and the electronic components, the core structure including a first penetration...

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Bibliographic Details
Main Authors Lee, Jaekul, Park, Jinseon, Myung, Junwoo
Format Patent
LanguageEnglish
Published 21.05.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A package module includes a core structure including a dummy member, one or more electronic components disposed around the dummy member, and an insulating material covering at least a portion of each of the dummy member and the electronic components, the core structure including a first penetration hole passing through the dummy member and the insulating material, a semiconductor chip disposed in the first penetration hole and having an active surface on which a connection pad is disposed and an inactive surface, an encapsulant covering at least a portion of each of the core structure and the semiconductor chip and filling at least a portion of the first penetration hole, and a connection structure disposed on the core structure and the active surface and including a redistribution layer electrically connected to the electronic components and the connection pad.
Bibliography:Application Number: US201916675877